MediaTek has launched new processors Dimensity 7450 and Dimensity 7450X, aimed at gaming and foldable phones

MediaTek officially unveiled the new Dimensity 7450 and Dimensity 7450X processors

The company announced the release of two mid‑range and premium smartphone chips – the Dimensity 7450 and its more “foldable” variant, the 7450X. The new models are already available on the manufacturer’s official website, and their appearance in both regular and foldable devices is expected soon. Rumors suggest that the Dimensity 7450X could be used in a new foldable Motorola Razr 70.

Overall specifications
| Parameter | Dimensity 7450 | Dimensity 7450X |
|---|---|---|
| CPU cores | 8 (4×Cortex‑A78 + 4×Cortex‑A55) | 8 (4×Cortex‑A78 + 4×Cortex‑A55) |
| A78 frequency | up to 2.6 GHz | up to 2.6 GHz |
| Process technology | 4 nm | 4 nm |
| GPU | Arm Mali‑G615 MC2 | Arm Mali‑G615 MC2 |
| Neural processor | 6th generation | 6th generation |
| Wi‑Fi | 6E | 6E |
| Bluetooth | 5.4 | 5.4 |
| G‑band speed | up to 3.27 Gbps (3CC) | up to 3.27 Gbps (3CC) |

Both chips are aimed at boosting performance in gaming, AI tasks, cameras, and network connectivity. The sixth‑generation neural processor delivers a 7 % higher local AI task processing speed compared with the previous generation.

Gaming technologies
* MediaTek HyperEngine – dynamic graphics optimization.
* Adaptive Gaming Technology 3.0 – balances performance and power consumption during gameplay.

Camera and video
* Support for 200‑MP sensors via Imagiq 950.
* 4K HDR recording, hardware noise reduction, Google Ultra HDR.
* Compatibility with displays up to WFHD+ (120 Hz) and Full HD+ (144 Hz).

Memory
| Memory type | Speed |
|---|---|
| LPDDR5/LPDDR4X | up to 6400 Mbps |
| UFS 2.2 / UFS 3.1 | – |

Foldable‑specific features (7450X)
* Optimized for two displays: internal and external screen.
* The “dual‑display” function makes it especially suitable for flip‑style foldable smartphones.

In short, the Dimensity 7450 and 7450X are nearly identical in most parameters, but the X version adds extra support for foldable devices. These chips are expected to appear in new mid‑range and premium smartphone models within the coming months.